Porosity: <1%.
Product Purity: 99.9%.
Bulk Density: 3.1-3.3 g/cm³.
Appearance Color: Blackish gray.
Product Introduction of Silicon Nitride Ceramic Sleeves
Silicon nitride ceramic sleeves (Si₃N₄) are high-performance ceramic materials composed of silicon and nitrogen elements bonded by strong covalent bonds. Their microstructure consists of interwoven elongated β-Si₃N₄ grains, which gives the material extremely high intrinsic strength and toughness. This material possesses characteristics such as high hardness, wear resistance, high elastic modulus, high strength, high temperature resistance, low thermal expansion coefficient, high thermal conductivity, good thermal shock resistance, low density, low surface friction coefficient, and good electrical insulation properties.
Main Characteristics
1. Mechanical Properties:
Hardness: Vickers hardness of over 1600 HV (HRA 90+).
Strength: Bending strength up to 600-800 MPa.
Toughness: Fracture toughness of 6-7 MPa·m¹/².
2. Thermal Properties:
Temperature Resistance: Stable operation in air up to 1200℃, and up to 1400℃ under protective atmosphere.
Coefficient of Thermal Expansion: Approximately 3.2×10⁻⁶/℃.
Thermal Conductivity: 18-25 W/m·K.
3. Chemical Properties:
Corrosion Resistance: Extremely strong resistance to acids, bases, and various corrosive media (except hydrofluoric acid and concentrated strong alkalis).
Oxidation Resistance: Forms a dense oxide film on the surface in high-temperature oxidizing environments, with oxidation resistance up to 1400℃ and above.
4. Other Properties:
Self-lubricating Properties: Friction coefficient of 0.02-0.1, wear rate is only 1/10 of traditional metal materials.
Electrical Insulation: Volume resistivity of 1.1×10¹² Ω·m.
Non-magnetic: Magnetic susceptibility less than 10⁻⁶ emu/g.
Application Fields
1. Mechanical Industry: Used in valves, pipes, classifying wheels, ceramic cutting tools, and bearing balls, especially suitable for high-speed machine tool spindle bearings and aerospace engine bearings.
2. Semiconductor Field: Used as a substrate for integrated circuit packaging, possessing high thermal conductivity and a thermal expansion coefficient that matches silicon chips.
3. Chemical Equipment: Used in corrosion-resistant pump and valve components, such as UHB mortar pump bushings.
4. Aerospace: Used in extreme environment components such as high-temperature guide bushings for aircraft engines.
Supports custom specifications.
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