Electrostatic Chuck (ESC)
Using dielectric materials such as aluminum oxide, it achieves non-damaging adsorption through an electrostatic field, suitable for plasma processes. Two types of structures exist: Coulomb type and JR type. The latter has stronger adsorption force but requires reverse voltage for desorption.
Advantages compared to traditional suction cups
characteristic | Ceramic suction cup | Traditional metal suction cups |
Adsorption uniformity | The microporous structure prevents local deformation. | Easily leads to wafer warping. |
Anti-static properties | Insulating materials eliminate electrostatic interference. | Additional anti-static treatment is required. |
Applicable scenarios | Ultra-thin wafers, high-precision manufacturing process | Routine handling, low-level manufacturing |
Supports custom specifications.
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