Dimensions: Common sizes include 20×20×9mm, 30×30×4mm, 50×50×0.32mm, 100×100×4mm, 107×107×4mm, and various other specifications.
Density: 2200-3200 kg/m³ (theoretical density 3100 kg/m³).
Working Temperature: Can withstand 1200℃ for short periods, with a high-temperature strength retention rate of up to 85%.
Bending Strength: 800-1000 MPa at room temperature, and still maintains over 500 MPa at 1200℃.
Product Introduction of Silicon Nitride Ceramic Sheets
Silicon nitride ceramic sheets (Si₃N₄) are high-performance ceramic materials bonded by strong covalent bonds. Their microstructure consists of interwoven, elongated β-Si₃N₄ grains, forming a unique "fish-scale-like" structure. This material exists in two crystalline forms: α-Si₃N₄ and β-Si₃N₄. The α-phase is primarily used in corrosion-resistant seals, while the β-phase is used in the manufacture of high-temperature bearings and cutting tools.
Main Characteristics
1. Physical Properties:
Mechanical Properties: Bending strength reaches 780-980 MPa, fracture toughness is 6.5-8.5 MPa·m¹/², more than twice that of alumina and aluminum nitride.
Hardness: Vickers hardness is 15-22 GPa (close to cubic boron nitride).
Wear Resistance: Surface friction coefficient is as low as 0.4-0.6, capable of resisting high-frequency friction and wear.
2. Thermal Properties:
Thermal Conductivity: 80-120 W/(m·K), five times that of alumina.
Coefficient of Thermal Expansion: 3.0×10⁻⁶/℃, perfectly matched with silicon chip materials.
Thermal Shock Resistance: Strength retention rate >90% during severe temperature cycling from -50°C to 1000°C.
3. Chemical Properties:
Corrosion Resistance: Almost no reaction with molten metals (aluminum, copper) and acid and alkali solutions (except HF) below 1200°C.
Insulation: Volume resistivity >10¹⁴ Ω·cm, breakdown field strength >15 kV/mm.
Application areas
Application areas | Application Scenarios | Advantages and Features |
mechanical Engineering | Bearings, sealing rings, cutting tools | High hardness, self-lubricating, wear-resistant |
Electronic packaging | IGBT module substrates, 5G communication components | High thermal conductivity, low dielectric loss |
Energy and power | Gas turbine blades, fuel cell components | High temperature resistance, thermal shock resistance |
Medical devices | Artificial joints | Biocompatibility, wear resistance |
Aerospace | Rocket nozzles, spacecraft components | Stability in special environments |
Supports custom specifications.
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