Density: 3.1-3.3 g/cm³.
Thermal conductivity: 80±10 W/(m·K).
Flexural strength: ≥700 MPa.
Fracture toughness: ≥6.5 MPa·m¹/².
Coefficient of thermal expansion: ≈3.2×10⁻⁶/K.
Maximum operating temperature: 1400℃.
Product Introduction of Silicon Nitride Ceramic Heating Plates
Silicon nitride ceramic heating plates are high-performance ceramic heat dissipation devices made from silicon nitride (Si₃N₄) as the core material. They are formed through a high-temperature sintering process, resulting in a dense structure with characteristics such as high thermal conductivity, high strength, high temperature resistance, and corrosion resistance. They are primarily used in electronic devices, power equipment, and aerospace applications as heat dissipation carriers or insulating support components for electronic components.
Main Features and Technical Advantages
1. Superior Thermal Conductivity:
Thermal conductivity reaches 200-400 W/(m·K), with actual commercial products having a thermal conductivity of 80-90 W/(m·K), which is 5 times that of alumina ceramics.
Low thermal expansion coefficient (≈3.2×10⁻⁶/K), providing good thermal matching with semiconductor chip materials.
2. Excellent Mechanical Properties:
Bending strength ≥800 MPa, fracture toughness ≥11.2 MPa·m¹/².
Vickers hardness reaches 14-16 GPa, exhibiting excellent wear resistance.
3. Outstanding High-Temperature Performance:
Maintains structural stability above 1200℃ and has excellent oxidation resistance.
Can withstand 5000 temperature cycles from -40 to 150℃ without cracking.
4. Good Chemical Stability:
Exhibits good corrosion resistance to most acids, bases, and molten metals.
Chemically stable in reducing atmospheres (H₂, CO).
Application Fields
1. Electronics and Semiconductor Industry: High-power LED heat dissipation substrates, IGBT module substrates, 5G communication and radar system heat dissipation components.
2. Mechanical and Industrial Fields: High-speed machine tool bearings, precision instrument ball bearings, cutting tools.
3. Energy and Environmental Protection Fields: Gas turbine components, aircraft engine components, solid oxide fuel cell interconnects.
4. Medical and Bioengineering: Artificial joints (hip joints, knee joints).
Supports custom specifications.
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