High-purity alumina ceramic substrates (typically with an alumina content of ≥99.5%) are widely used in industrial applications. Their core characteristics and supplier information are as follows:
Core Characteristics
1. High Insulation: Dielectric loss ≤0.0002, dielectric strength ≥18KV/mm, suitable for high-frequency circuits and semiconductor devices.
2. High Temperature Resistance and Thermal Stability: Withstands harsh thermal cycling (-55℃ to +150℃), and its thermal expansion coefficient matches that of silicon chips, reducing the risk of solder layer cracking.
3. Mechanical Properties: Bending strength ≥300MPa, Vickers hardness ≥1800, wear-resistant and impact-resistant.
4. Thermal Management Capability: Thermal conductivity reaches 32W/(m·K), superior to conventional ceramic materials, which helps dissipate heat from electronic components.
Application Scenarios
1. Photovoltaic/Semiconductor Equipment: Ceramic boat supports for solar silicon wafers, robotic arms for wafer handling.
2. Electronic Packaging: Gold-plated substrates used in high-thermal-conductivity ceramic copper-clad laminates to improve circuit stability.
3. High-Temperature Industry: Kiln loading supports ensure uniform heating of ceramic balls (patented design including electric cylinder temperature control structure).
4. Laboratory Equipment: High-temperature resistant crucible supports, insulating fixtures, etc.
Supports custom specifications.
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